WUXGA resolution becomes feasible for OLED micro displays

January 06, 2017 //By Annett Arnold, Fraunhofer FEP
WUXGA resolution becomes feasible for OLED micro displays
At the SID Mid-Europe Chapter Spring Meeting on wearable and projection displays in March, the Fraunhofer Institute for Organic Electronics (Fraunhofer FEP) will introduce a new generation of OLED micro displays. With these developments, the Dresden, Germany, based research institute demonstrates the progress that has been made over the past couple of years in the area of cost-effective micro displays.

With applications ranging from gaming to professional uses such for assembly, maintenance information supply, and pilot training in flight simulators, virtual reality glasses and their supporting systems are becoming more and more established, whilst at the same time also initiating and facilitating developments in new fields. A crucial aspect of virtual reality presentations is the display technology. Here, OLED micro displays are receiving growing attention due to their technological advantages.

Fraunhofer FEP has long-term experience and a vast knowledge of the development and fabrication of customized OLED micro displays for various applications. Within the EU-funded H2020 project LOMID (Large cost-effective OLED micro displays and their applications) which is led by scientists at the Fraunhofer FEP, a new generation of large area OLED micro displays has been developed which focus on both virtual-reality (VR) and augmented-reality (AR, the latter will be tested within the project in visual prosthetics). 


In the LOMID project, flexible OLED micro displays of exceptionally large area (13 mm × 21 mm) with a screen diagonal of 24.9 mm ( about 1”) will be manufactured at challenging high yields (>60%). This will be achieved by developing a robust silicon-based chip design enabling both high resolution (1200×1920 (WUXGA) with pixel sizes of 11 µm × 11 µm for a pixel density of 2300 ppi) and highly reliable manufacturing of the backplane.


Mike Thieme, project manager at LOMID contributor X-FAB, says: “Economical processes (e.g. based on 0.18 and 0.35 µm lithography) are being developed at the CMOS silicon foundry and special attention will be given to the interface between the top metal electrode of the CMOS backplane and the subsequent OLED layers. To keep the CMOS manufacturing at low cost, numerous design rules have been pushed to their limits.”


Additional challenges such as conformability of the OLED micro displays will be addressed to allow a bending radius of 50 mm. Along with these new functionalities, the durability

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