Wireless SoCs target eco-friendly Zigbee Green Power IoT devices

February 19, 2020 //By Rich Pell
Wireless SoCs target eco-friendly Zigbee Green Power IoT devices
Silicon Labs has announced a new family of secure, ultra-low-power Zigbee system-on-chip (SoC) devices designed for eco-friendly IoT products deployed in mesh networks.

The EFR32MG22 (MG22) family, says the company, delivers the smallest, lowest power SoCs optimized for Zigbee Green Power applications. Based on the company's Wireless Gecko Series 2 platform, the MG22 SoCs are suited for Zigbee devices powered by coin cell batteries or energy-harvesting sources, with target applications including smart home sensors, lighting controls, and building and industrial automation.

"As the leading Zigbee provider, Silicon Labs is uniquely positioned to lead the way in Zigbee Green Power mesh networking solutions," says Matt Johnson, senior vice president and general manager of IoT products at Silicon Labs. "Our new MG22 SoC solution offers an industry-leading combination of energy efficiency, security capabilities, wireless performance, and software tools and stacks to meet the growing market demand for eco-friendly, ultra-low-power IoT products."

Zigbee Green Power technology, says the company, can help address environmental concerns by reducing residential, commercial, and industrial energy footprints, one IoT device at a time. Using the same 802.15.4 PHY and MAC of the Zigbee 3.0 protocol, Zigbee Green Power further reduces power consumption by decreasing the amount of data required for wireless transmission.

Zigbee Green Power was designed to be a highly efficient protocol enabling IoT devices powered by batteries or by "battery-less" energy harvesting options. The new MG22 SoCs, says the company, were optimized to provide a best-in-class connectivity solution for these challenging, power-sensitive wireless applications.

The MG22 SoCs incorporate a high-performance, low-power 76.8-MHz Arm Cortex-M33 core with TrustZone. Other features include ultra-low transmit and receive power (8.2 mA TX at +6 dBm, 3.9 mA RX), a 1.4 µA deep-sleep mode power, and low-power peripherals.

The EFR32MG22 SoCs are planned to start shipping in March in a choice of 5 mm x 5 mm QFN40, 4 mm x 4 mm QFN32, and slender 0.3 mm x 4 mm x 4 mm TQFN32 packages. A EFR32MG22 SoC starter kit is also planned to be available in March, with end device kit pricing


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