Infineon Technologies has launched the industry’s first 1x1 WiFi6E and Bluetooth 5.2 single chip for the IoT and industrial applications.
The AIROC WiFi6E combo solutions operate in the 2.4 GHz, 5 GHz, and the new, greenfield 6 GHz spectrum to deliver robust performance and minimal latency. Infineon has also launched the first 2x2 WiFi6E and Bluetooth 5.2 combo chip for multimedia, consumer and automotive applications.
The multiple antenna support gives double the wireless coverage range compared to WiFi5 and WiFi4, with 40 percent more coverage than typical Wi-Fi 6/6E solutions and improved connection robustness with enhanced interference mitigation. The chip also has lower latency and better Wi-Fi/BT coexistence over previous versions that improves multimedia streaming and gaming responsiveness in overlapping network environments. This enables 20 percent power savings for longer battery life.
The chips include multi-layer security protections with secured boot, firmware authentication and encryption and lifecycle management for industrial IoT applications.
“AIROC Wi-Fi 6/6E combo solutions address the challenges of congested 2.4 GHz and 5 GHz channels, and bring extraordinary audio and video quality for media applications and robust, long-range connections for IoT applications,” said Vikram Gupta, Senior Vice President of Infineon’s IoT Compute and Wireless Business Unit.
The Bluetooth 5.2 technology in AIROC adds high-quality audio with LC3 for new BLE audio use cases such as audio sharing and audio broadcast. A low-power Wake-on-Bluetooth LE mode allows the host CPU to conserve power while the Bluetooth core autonomously “listens” for incoming connection requests. Advanced wireless technology innovations have been added to improve BT/BLE range, robustness, latency and power savings above and beyond standard BT5.2. Infineon’s Smart Coex coexistance design maximizes Wi-Fi throughput when used concurrently with Bluetooth, and optimizes for demanding multi-media use cases.
Infineon’s module partners have used the chip to enable rapid development, reduced test costs, and product certification.
“Collaborating with Infineon allows us to leverage our combined expertise to develop innovative Wi-Fi solutions which further build upon our market-leading position,” said Akira Sasaki, General Manager of Murata. “Our most recent collaboration is a Wi-Fi 6/6E CYW5557x module that delivers advanced technology integration, superb network quality, and enables fast time-to-market. Further, it can be delivered through Murata’s extensive sales and distribution channel.”
“LG Innotek is excited to partner with Infineon on the new Wi-Fi 6E communication module which carries the CYW89570 chip,” said Insoo Ryu, Vice President Automotive Components & Electronics Business Division, LG Innotek. “This module extends LGIT’s automotive/industrial product family into the next generation and brings the latest Wi-Fi 6E and Bluetooth 5.2 standards to automotive platforms.”
For automotive applications, u-blox builds AECQ100 qualified and industrial modules with Infineon’s Wi-Fi 6E combo solution. “At u-blox, we are excited to work with Infineon on the new CYW89570,” said Hakan Svegerud, Senior Director Product Strategy, u-blox. “Based on these solutions, we will extend our successful JODY module family with global automotive and industrial grade modules, providing cutting edge technologies including Wi-Fi 6, Wi-Fi 6E and Bluetooth 5.2 to our customers.”
“nFore’s NF3327PQ Combo module has Infineon’s CYW89570 chipset inside. Infineon’s CYW89570 chipset is the perfect chipset for enabling Wi-Fi 6 and Bluetooth 5.2 technologies for automotive customers,” said Mr. Yu Zongyuan, CEO of nFore Technology.
The AIROC Wi-Fi 6 / 6E and Bluetooth 5.2 combo is currently sampling to select customers.