Cannon ITT’s MDM and MDV series data, power and signal interconnects combine versatility with high performance and high reliability and are designed to be comparable with MIL-DTL-83513-style connectors. With properties like moisture sealing and ultra-high temperature option, these connectors suit aerospace and oil exploration environments.
The MDM and MDV Micro Series are available in eight shell sizes, and accommodate nine to one hundred contacts (copper alloy or gold plated) in positions 9, 15, 21, 25, 31, 27, 51 and 100. Wire sizes are AWG 24 to AWG32. The interconnects use the Cannon field-proven micro twist pin contact system, which reverses the traditional pin and socket arrangement and ensures that the pins will mate even under misalignment conditions. Highly robust, the MDM and MDV Micro Series can withstand 500 mating cycles. Available configurations include Micro-D Metal (MDM); coaxial/power, PCB, surface mount, micro strip, hermetic, filter, centre jackscrew and circular connectors.
Across the MDM Series there are three temperature variations: the Micro MDM Standard at -55degC to +150degC, the High Temp Micro MD F222 Series at -55degC to +200degC, and the Ultra-High Temp Micro MDM F300 Series covers -55degC to +230degC.
For more information about TTI, visit www.ttieurope.com