The company, in collaboration with quantum computing research center QuTech, says that it has for the first time demonstrated the operation of qubits that are "hot, dense, and coherent." These compact qubits function at high quality and at relatively high temperatures, potentially addressing the challenge of storing quantum information, which is normally quickly lost unless the qubits are cooled to near absolute zero (-273 degrees Celsius or 0 kelvin).
The research also highlighted individual coherent control of two qubits with single-qubit fidelities of up to 99.3%. These breakthroughs, says the company, highlight the potential for cryogenic controls of a future quantum system and silicon spin qubits, which closely resemble a single electron transistor, to come together in an integrated package.
"This research represents a meaningful advancement in our research into silicon spin qubits, which we believe are promising candidates for powering commercial-scale quantum systems, given their resemblance to transistors that Intel has been manufacturing for more than 50 years," says Jim Clarke, director of quantum hardware, Intel Labs. "Our demonstration of hot qubits that can operate at higher temperatures while maintaining high fidelity paves the way to allow a variety of local qubit control options without impacting qubit performance."
While single-qubit control above 1 K with silicon quantum dots is demonstrated simultaneously with this work, control of two qubits was only achievable until now at a reduced temperature of 40 millikelvins. Intel's research with QuTech shows full two-qubit logic in a quantum circuit operating at 1.1 K.
Through this research, Intel and QuTech say they have demonstrated the ability to control the electron spin of a two-qubit system measuring single-qubit fidelities of up to 99.3% and accurate tunability of the system. Further, they say, this has illustrated that performance of spin qubits is minimally affected in the temperature ranges of 45 millikelvin to 1.25 kelvin.
The approach, says the company, enables it to leverage its expertise in advanced packaging and