Cost-optimized UltraScale+ devices for ultra-compact edge compute

March 29, 2021 // By Rich Pell
Cost-optimized UltraScale+ devices for ultra-compact edge compute
Programmable logic device company Xilinx has announced that it has expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions.

Available in TSMC's state-of-the-art InFO (Integrated Fan-Out) packaging technology, the new Artix and Zynq UltraScale+ devices feature form factors that are 70 percent smaller than traditional chip-scale packaging, says the company, and can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets. Using InFO, Artix and Zynq UltraScale+ devices are offered as being able to meet the need for intelligent edge applications by delivering high-compute density, performance-per-watt, and scalability in compact packaging options.

"Demand for compact, intelligent edge applications is driving the requirement for processing and bandwidth engines to not only provide higher performance, but also new levels of compute density to enable the smallest form factor systems," says Sumit Shah, senior director, Product Line Management and Marketing at Xilinx. "The new cost-optimized additions to our UltraScale+ portfolio are powerful enhancements that leverage the architecture and production-proven technology of Xilinx’s UltraScale+ FPGAs and MPSoCs, which collectively have been deployed in millions of systems worldwide."

The Artix UltraScale+ family is built on the company's production-proven FPGA architecture and is offered as ideal for a range of applications including machine vision with advanced sensor technology, high-speed networking, and ultra-compact "8K-ready" video broadcasting. Artix UltraScale+ devices deliver 16 gigabits-per-second transceivers to support emerging and advanced protocols in networking, vision, and video, while also delivering what the company claims is the highest DSP compute in its class.

Cost-optimized Zynq UltraScale+ MPSoCs include the new ZU1 and production-proven ZU2 and ZU3 devices, all available in InFO packaging. As part of the multiprocessing SoC line from the Zynq UltraScale+ family, ZU1 is designed for connectivity at the edge and for industrial and healthcare IoT systems, including embedded vision cameras, AV-over-IP 4K and 8K-ready streaming, hand-held test equipment, as well as consumer and medical applications. ZU1 is built for miniaturized compute-intensive applications and powered by a heterogeneous Arm processor-based multicore processor subsystem, while also being able to migrate to common package footprints for greater compute.

Both cost-optimized Artix and Zynq UltraScale+ families include the same robust security features found across the UltraScale+ portfolio. Included are RSA-4096 authentication, AES-CGM decryption, DPA countermeasures, and the company's proprietary Security Monitor IP that adapts to security threats across the product life cycle, meeting the security needs for both defense and commercial projects.

The first cost-optimized Artix UltraScale+ devices are expected to be available in production by Q3 CY2021, with Vivado Design Suite and Vitis Unified Software Platform tool support starting late summer. Zynq UltraScale+ ZU1 devices will also begin sampling in Q3 with tool support in Q2, and volume production of the extended portfolio beginning Q4.

Xilinx



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