Offered in a single, 1/4” optical format package, the OX01E10 integrates a 3 micron 1340x1020 pixels image sensor and an advanced image signal processor (ISP), enabling designers to achieve a small form factor with excellent low-light performance, ultra-low power and reduced cost while improving reliability by using only one printed circuit board. Additionally, the OX01E10 provides two on-screen display overlay layers for driver guidelines, as well as distortion correction to straighten any curved edges from lenses with a wide viewing angle.
The OX01E10 draws 35% less power than competitors’ solutions and significantly reduces temperature, the vendor says, hence the imaging device does not require a metal heat sink, allowing for the use of plastic camera module bodies to reduce costs. With its compact package size, it also enables smaller cameras that can fit in much tighter spaces. In addition, by integrating both the image sensor and ISP into a single chip, designers can save on both cost and space by eliminating the second PCB in typical two-chip implementations.
OmniVision’s dual conversion gain (DCG) technology is employed in this SoC to achieve a high dynamic range (HDR) of 120dB with only two captures, as opposed to three required by the competition, which minimizes motion artifacts while reducing power consumption and boosting low-light performance.
OmniVision - www.ovt.com