The Dimensity 5G chipset family, says the company, brings "smart and fast" together to power the world's most capable 5G devices, and represents a step toward a new era of mobility - the fifth dimension - to spur industry innovation and let consumers unlock the possibilities of 5G connectivity.
"We chose the name 'Dimensity' to highlight how our 5G solutions are driving new waves of innovation and experiences, much like the fabled fifth dimension," says MediaTek President Joe Chen. "Our first announced chip, MediaTek Dimensity 1000, gives consumers a significantly faster, more intelligent and all-around incredible mobile experience."
The Dimensity series integrates the company's 5G modem in one compact design, delivering significant power savings compared to competing solutions. The Dimensity 1000 5G SoC supports 5G two carrier aggregation (2CC CA) and offers 4.7-Gbps downlink and 2.5-Gbps uplink speeds over sub-6-GHz networks.
The chipset is designed to support standalone and non-standalone (SA/NSA) sub-6-GHz networks, and includes multi-mode support for every cellular connectivity generation from 2G to 5G. It also integrates the latest Wi-Fi 6 and Bluetooth 5.1+ standards, offering more than 1 Gbps throughput in both downlink and uplink speeds.
The SoC pairs four Arm Cortex-A77 cores operating up to 2.6 GHz with four power-efficient Arm Cortex-A55 cores operating at up to 2.0 GHz. This design, says the company, enables an optimal balance of high performance and power efficiency. The chipset is also claimed to be the world's first to pack Arm Mali-G77 GPU to enable seamless streaming and gaming at 5G speeds.
The Dimensity 1000 also comes with a new MediaTek AI Processing Unit - APU 3.0 - offering more than double the performance of the previous generation APU at 4.5 TOPS.
The SoC offers the following features and technology:
- Dual 5G SIM: With the world's first dual 5G SIM technology, in addition to support for services such as Voice over New Radio (VoNR), the 5G SoC delivers seamless connectivity