How Infineon controls and assures the reliability of SiC based power semiconductors

By Infineon Technologies AG
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“One of the success factors of implementing SiC as a power device material is the chance to adopt many of the well-known device concepts and processing technologies from silicon. Among those are the basic device designs like vertical Schottky diodes or vertical power MOSFETs (after some detours via JFETs and… Read More


“One of the success factors of implementing SiC as a power device material is the chance to adopt many of the well-known device concepts and processing technologies from silicon. Among those are the basic device designs like vertical Schottky diodes or vertical power MOSFETs (after some detours via JFETs and BJT’s as alternative structures). Thus, many of the procedures used to verify the long term stability of silicon devices could be transferred to SiC. Nevertheless, a deeper analysis has shown that SiC based devices require additional and different reliability tests compared to Si based ones. Download this paper for a tutorial on the major steps required for a successful release of highly reliable SiC based products.”

INFINEON lOGO


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