Hybrid optical-electrical interconnects for co-packaged optics
New Products |
Connectivity specialist Molex has announced its first-to-market, pluggable module solution for co-packaged optics (CPO).
Going down: Annual chip market growth continued to soften in May
Market news |
Recent trends in the global chip market continued in May with the Americas region maintaining strong growth while Chinese market…
Samsung starts 3nm chip production ahead of TSMC.
Technology News |
Samsung Electronics Co. Ltd. has announced it has started production of its 3nm process using a nanosheet gate-all-around (GAA) architecture.
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