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Boards & Embedded Cards Page 7

Boards & Embedded Cards Page 7
Semtech buys Sierra Wireless in $1.2bn deal
Semtech buys Sierra Wireless in $1.2bn deal
Business news |
Mixed signal chip designer Semtech is to buy wireless module maker Sierra Wireless in a definitive deal worth $1.2bn. The…
Chinese invasion of Taiwan would make TSMC ‘not operable’, says chairman
Chinese invasion of Taiwan would make TSMC ‘not operable’, says chairman
Business news |
Mark Liu, chairman of foundry Taiwan Semiconductor Manufacturing Co. Ltd., has said that a Chinese invasion of Taiwan would render…
US chip suppliers dominate R&D spending
US chip suppliers dominate R&D spending
Market news |
The US and Asia-Pacific have increased their share of global semiconductor R&D over the last ten years at the expense…
UK looks to £250m to secure 5G and 6G telecoms supply chain
UK looks to £250m to secure 5G and 6G telecoms supply chain
Business news |
The UK government has announced a £250 million Open Networks R&D Fund to accelerate the development and deployment of open…

Bluetooth 5 Low Energy module for harsh radio environments
Bluetooth 5 Low Energy module for harsh radio environments
New Products |
Panasonic Industry has used a chip from Nordic Semiconductor for a Bluetooth 5 Low Energy (LE) module for harsh radio environments. The PAN1770 module is based on the nRF52840 single…
First microATX board with HPC-COM interface to tackle supply chain issues
First microATX board with HPC-COM interface to tackle supply chain issues
New Products |
congatec in Germany has launched the first modular MicroATX compliant carrier board with a COM-HPC interface to avoid supply chain issues with mainstream motherboards. The microATX board can be equipped…
Increased body height Datamate connector
Increased body height Datamate connector
New Products |
UK connector maker Harwin has launched a high reliability Datamate connector with larger 17.15mm connection height to provide more room between boards. The female connector gives the significantly larger 17.15mm…
OSM-format ARM SiP for industrial and IoT designs
OSM-format ARM SiP for industrial and IoT designs
New Products |
Aries Embedded has launched a system-in-package (SiP) with the multicore STM32MP1 ARM processor from ST Microelectronics for industrial and IoT designs. The MSMP1 brings one or two ARM CortexA7 processor…
Crolles fab helps keep Europe in deep tech
Crolles fab helps keep Europe in deep tech
Opinion |
The news that ST’s Crolles site in France will gain another 300mm wafer fab and a base for further FDSOI process development is a good thing for Europe, the companies…
Congatec drives Robotics 4.0 in China
Congatec drives Robotics 4.0 in China
Business news |
Intel Labs China has chosen COM Express modules from congatec in Germany for a new robotics development platform for Asia. The Heterogeneous Extensible Robot Open (HERO) platform was created by…
Opinion: Next Crolles wafer fab helps keep Europe in the deep tech game
Opinion: Next Crolles wafer fab helps keep Europe in the deep tech game
Opinion |
The news that ST’s Crolles site in France will gain another 300mm wafer fab and a base for further FDSOI process development is a good thing for Europe, the companies…
Iceotope raises £30m for immersive cooling 
Iceotope raises £30m for immersive cooling 
Business news |
UK immersive cooling developer Iceotope Technologies has raised £30m ($36m, €35m) to boost growth. This brings the total raised to over $73m since the company formed in 2005 in Sheffield.
Newport chip foundry still possible says Nexperia
Newport chip foundry still possible says Nexperia
Business news |
A foundry at the Newport wafer fab in Wales, UK, is still possible, a senior executive from Nexperia has told UK law makers. Toni Versluijs, UK country manager at Nexperia,…
Newport chip foundry is still possible, Nexperia’s Versluijs tells MPs
Newport chip foundry is still possible, Nexperia’s Versluijs tells MPs
Business news |
Toni Versluijs, UK country manager at Nexperia, has told UK members of parliament that his company’s offer to support a compound semiconductor foundry within Nexperia Newport has been on the…
Raspberry Pi Pico goes wireless
Raspberry Pi Pico goes wireless
New Products |
The Raspberry Pi Foundation has introduced three new members of its Pico family, the organization's first product using the internally designed RP2040 microcontroller.
Going down: Annual chip market growth continued to soften in May
Going down: Annual chip market growth continued to soften in May
Market news |
Recent trends in the global chip market continued in May with the Americas region maintaining strong growth while Chinese market annual growth fell again. The global chip market was worth…
NXP S32G-based, FuSa-qualified system-on-module targets vehicle connectivity
NXP S32G-based, FuSa-qualified system-on-module targets vehicle connectivity
New Products |
MicroSys Electronics extends the scalability of its NXP S32G-based miriac system-on-module family with higher real-time data processing performance for mixed-critical safety applications.
Nexperia executive to give evidence to UK government
Nexperia executive to give evidence to UK government
Business news |
Toni Versluijs, country manager at Nexperia UK, will give oral evidence to Members of Parliament about the domestic semiconductor sector on Tuesday July 5 in the morning. Versluijs, who is…
Raspberry Pi adds wireless on $6 pico W board
Raspberry Pi adds wireless on $6 pico W board
New Products |
Raspberry Pi has added wireless connectivity to its low cost pico board as well as pre-soldered headers and a debug interface. The $6 pico W board (above) adds the Infineon…
PICMG prepares microTCA standard for PCIe5.0
PICMG prepares microTCA standard for PCIe5.0
Technology News |
Over a decade after the original version of the microTCA board standard, the PICMG group is working on a new version to support more modern requirements. The MicroTCA Working Group…
Mezzanine SOSA VPX chassis manager releases a slot
Mezzanine SOSA VPX chassis manager releases a slot
New Products |
Pixus Technologies has developed a VITA 46.11 (VPX) compliant chassis manager that sits behind an OpenVPX backplane. This mezzanine-based approach allows for chassis management without sacrificing a slot. The SHM300…
Battery powered AI acoustic event detection design
Battery powered AI acoustic event detection design
Technology News |
Infineon Technologies has launched a reference design for a battery-powered AI acoustic detector board that uses machine learning and sensor fusion. The Smart Alarm System (SAS) achieves high accuracy and…
Chip market falls in 1Q22
Chip market falls in 1Q22
Market news |
The semiconductor market declined sequentially in 1Q22 but not by as much as normal seasonality would have dictated, according to market analysis firm Omdia. The market declined sequentially by 0.03…
Chip market went flat in 1Q22
Chip market went flat in 1Q22
Market news |
The semiconductor market declined sequentially in 1Q22 but not by as much as normal seasonality would have dictated, according to market analysis firm Omdia. The market declined sequentially by 0.03…
congatec enters functional safety market
congatec enters functional safety market
Business news |
German board maker congatec is entering the functional safety (FuSa) market based around the latest Intel processor on a COM Express module. Functionally safe embedded computing platforms are needed in…
European RISC-V chip for IoT development kit
European RISC-V chip for IoT development kit
Technology News |
The OpenHW Group has launched an open-source RISC-V Development Kit based around the European CORE-V microcontroller and an open printed circuit board (PCB) design that supports Amazon Web Services (AWS)…
3.5in single-board computer for IoT edge designs
3.5in single-board computer for IoT edge designs
New Products |
Kontron in Germany has launched a 3.5in single-board computer for developing compact IoT edge devices with low power consumption and high computing and graphics performance. The 3.5″-SBC-EKL is aimed at…
SGET boosts embedded module standard, launches design guide
SGET boosts embedded module standard, launches design guide
Business news |
The Standardization Group for Embedded Technologies (SGET) has published two important milestones for its Open Standard Module (OSM) specification. OSM version 1.1 provides backward-compatible improvements and future-proof extensions, while the…


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