Nordic Semi shrinks Bluetooth LE SoC package for wearables

Nordic Semi shrinks Bluetooth LE SoC package for wearables

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Targeting next-generation wearables and space-constrained IoT applications, Nordic Semiconductor’s (Trondheim, Norway) nRF52832 Wafer Level Chip Scale Package (WL-CSP) has a 3.0 x 3.2-mm footprint that occupies one quarter of the footprint area of Nordic's standard 6.0 by 6.0 mm QFN48-packaged nRF52832, and offers the same feature set.
By Rich Pell


The WL-CSP variant of the nRF52832 Bluetooth low energy (formerly known as Bluetooth Smart) System-on-Chip (SoC)maintains the single-chip feature set and, ultra-low-power application operation with its 64MHz ARM Cortex-M4F processor that enables protocol and application task processing to be completed in short time-frames, thus allowing power-saving sleep modes to be entered more quickly.

Like the nRF52832, the nRF52832 WL-CSP features: 512 kB Flash and 64 kB RAM; on-chip NFC tag for Touch-to-Pair; high performance, ultra-low-power multi-protocol Bluetooth low energy, ANT, and proprietary 2.4GHz radio; 5.5 mA peak RX/TX currents; an on-chip RF Balun; plus a fully-automatic power management system that simplifies achieving optimal power consumption.

The nRF52832 WL-CSP is compatible with Nordic’s Bluetooth 4.2 stacks and supporting SDKs including the latest S132 multi-role concurrent software stack, nRF5 SDK, nRF5 SDK for HomeKit, and nRF5 SDK for AirFuel (resonant wireless charging).

“The availability of a super-compact footprint nRF52832 brings new design opportunities to wearables and other space-constrained IoT applications,” comments Kjetil Holstad, Product Manager Ultra Low-Power Wireless at Nordic Semiconductor, adding, “The evolution of wearables to date has only ever gone one way: ever increasing performance and functionality in ever-slimmer, lighter, form factors. The nRF52832 WL-CSP is by a clear margin, the smallest and most advanced Bluetooth low energy SoC available on the market today.”

Nordic Semiconductor;

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