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3rd-gen HYPERRAM doubles bandwidth for IoT applications

New Products |
By Rich Pell


The HYPERRAM product range offers compact alternatives to traditional pseudo-SRAM and is well-suited to low power, space-constrained IoT applications that require an off-chip external RAM, such as wearables, instrument clusters in automotive applications, infotainment and telematics systems, industrial machine vision, HMI displays and communication modules. New IoT devices execute more than simple machine to machine communication – they perform voice control or tinyML inferences and therefore need a higher memory performance, say the companies.

HYPERRAM 3.0 is the new generation able to operate under the same command/address signal and similar data bus format with enhanced bandwidth and the same standby power with little pin change. HYPERRAM 3.0 operates at a maximum frequency of 200 MHz with a 1.8-V operation voltage, which is the same as both HYPERRAM 2.0 and OCTAL xSPI RAM, but with an increased data-transfer rate of 800 MBps – double the rate that was previously available. The new generation HYPERRAM operates via an expanded IO 16-bit HyperBus interface with 22 pins.

The first member of the HYPERRAM 3.0 family will be a 256Mb device in a KGD, WLCSP Package, which can be implemented at the component level, module level or PCB level based on the end product type. The 256-Mb HYPERRAM 3.0 devices are now sampling.

Winbond
Infineon Technologies


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